Dielectric Analysis - DEA Hardening Automatic Measurement Device "LT/LTF Series"
Visualizing the reaction processes of various resin materials! Continuously monitor the viscosity changes and curing progress of resin materials in-process with high sensitivity.
It provides information on resin reactions that cannot be obtained using conventional lab-scale thermal analysis devices (such as DSC, DMA, and rheometers). By conducting high-sensitivity dielectric analysis (DEA) online and in real-time during the reaction processes of various liquid resins, FRP/CFRP composites, and molding materials, it analyzes material flow, viscosity changes, gelation, degree of curing and crosslinking progress, and reaction termination, thereby offering the development of more appropriate molding conditions and quality control tests for materials. The sensors can be permanently mounted in molds and used in actual processes such as pressing, RTM (VaRTM) molding, and autoclaving for curing and reaction analysis. Compact and cost-effective models (LT-451, LTF-631, LT-439) are available to accommodate fast reactions in just a few seconds as well as long-duration reactions. Additionally, multiple sensors (1ch to 8ch) can be used simultaneously for effective evaluation of molding properties and curing behavior at multiple points. This technology can be applied from material development and quality control to production sites. For more details, please refer to the catalog and materials.
- 企業：シスコム（SysCom）
- 価格：1 million yen-5 million yen
